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shinko substrate

shinko substrate

Advanced organic substrate technologies to enable high density lines and fine diameter vias by implementing original sputtering seed layer into our reliable ...

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shinko substrate 相關資訊

  • Lower cost; High reliability substrate application is possible; Optimization of substrate ...
    2L4L P-BGA Substrate | IC Package | SHINKO ELECTRIC ...
    http://www.shinko.co.jp
  • Advanced organic substrate technologies to enable high density lines and fine diameter via...
    Advanced fine-line technologies on organic substrates | R&D ...
    http://www.shinko.co.jp
  • Related to the recent performance improvement of electronic devices using Build-up Substra...
    Build-up Substrate(Flip-chip type) | IC Package | SHINKO ELE ...
    http://www.shinko.co.jp
  • Related to the recent performance improvement of electronic devices using Build-up Substra...
    Build-up Substrate(Flip-chip type) | IC Package | SHINKO ELECTRIC ...
    http://www.shinko.co.jp
  • May 29-June 1, 2012-No2- K.Tanaka SHINKO IBM SYMPOSIUM Nov. 13th‘2012 Page 2 Contents 1. L...
    Coreless Substrate and its Extension - IBM - United States
    http://www-03.ibm.com
  • IC Package/ Build-up Substrate. DLL® (Direct Laser & Lamination). Concept ...
    DLL Build-up Substrate| IC Package | SHINKO ELECTRIC ...
    http://www.shinko.co.jp
  • IC Package/ Build-up Substrate. DLL3® (Coreless Substrate). Concept ...
    DLL3(Coreless Substrate) | IC Package | SHINKO ELECTRIC ...
    http://www.shinko.co.jp
  • Flip Chip is a point-to-point interconnection method with so called solder bumps for elect...
    IC Package Substrates | IBIDEN's Principal Products | ...
    http://www.ibiden.com
  • IC substrates represent the highest level of miniaturization in PCB manufacturing and shar...
    IC Substrates - TTM Technologies, Inc.
    http://www.ttmtech.com
  • Optimization of substrate design considering electrical performance; High density wiring b...
    IVH (Build-up Substrate with core) P-BGA Substrate | IC Package ...
    http://www.shinko.co.jp
  • Optimization of substrate design considering electrical performance; High density wiring b...
    IVH 3(Coreless Substrate ) P-BGA Substrate | IC Package | SHINKO ...
    http://www.shinko.co.jp
  • The Plastic-BGA substrates are mainly used for memory, controller, chipsets, and on-vehicl...
    P-BGA Substrate | Products & Services | SHINKO ELECTRIC ...
    http://www.shinko.co.jp
  • The patent's assignee for patent number 9736941 is SHINKO ELECTRIC INDUSTRIES CO., LTD...
    SHINKO ELECTRIC INDUSTRIES : Patent Issued for Wiring Substr ...
    http://www.4-traders.com
  • Fine-pitch routing on the substrate enables cost reduction. The interposer board can be ei...
    System in Package| Products & Services | SHINKO ELECTRIC ...
    http://www.shinko.co.jp
  • The Requirement of Future Substrate-Maker Point of View - Dyi-Chung Hu ((((胡迪群))) Senior V...
    The Requirement of Future Substrate - iNEMI
    http://thor.inemi.org
  • A wiring substrate includes a first insulation layer, a wiring layer formed on an upper su...
    Wiring substrate - SHINKO ELECTRIC INDUSTRIES CO., LTD. ...
    http://www.freepatentsonline.c
  • 2011年6月20日 - SHINKO has started volume production for DLL3Ⓡ. ( DLL3Ⓡ is SHINKO's ... ...
    [PDF] SHINKO Coreless Substrate DLL3 in High Volume Production
    http://www.shinko.co.jp
  • ‘Global and China IC Substrate Industry Report, 2015’ highlights the followings: 1. Status...
    全球和中國的IC基板產業分析 - GII
    http://www.giichinese.com.tw